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FlipChipInternational (FCI) is a privately held supplier of products and services for the wafer bumping and wafer level packaging market. FCI is a world leading WLCSP bumping supplier with 1,000,000+ wafers processed at our primary bumping facility and technology development site located in the World Headquarters building in Phoenix, Arizona, USA. This facility is a state of the art 16,000-ft2 (4700 m2), class 1000 clean room. FlipChip – Phoenix is ISO9001:2000, TS16949, and ISO14001 certified.
In addition to offering the industry’s broadest assortment of wafer bumping options, FCI has maintained an aggressive program to develop and generate intellectual property for future implementation at FlipChip-Phoenix and in our Asian factory locations. Our commitment to leadership and quality in wafer bumping solutions continues, ensuring that FCI remains the leader in developing, and bringing to market the latest in bumping technology.
FCI is a subsidiary RoseStreet Labs LLC, a supplier of products and services for semiconductor, life science, and renewable energy markets.