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UMC's goal is to deliver leading-edge process technologies to our customers with the highest wafer yields and shortest cycle times. Our R & D program is one of the most aggressive and successful in the industry, resulting in manufacturing excellence that is passed directly to our customers. In recent years, UMC has led the foundry industry in the introduction of 0.25 um and 0.18 um manufacturing technology. UMC has also pioneered the introduction of innovative new materials, such as copper interconnects used for our 0.13 um and below process generations. In early 2003, UMC became the first foundry to deliver working customer products using advanced 90nm technology.
UMC has the right technology to suit today's new and innovative applications including specialty technologies such as RFCMOS, microdisplay, and high voltage technologies. UMC has focused a wide range of design solutions that support our processes. Silicon verified libraries (standard cells and I/Os) optimized to our technologies are available free-of-charge from several leading vendors. We also offer a wide range of mixed-signal, analog, and digital IP cores, with many pre-proven in UMC silicon. And, because silicon verification is such a critical issue for customers' deep sub-micron designs, UMC has launched the Silicon Shuttle multi-chip test wafer program.
UMC is also a leader in 300 mm manufacturing, which enables customers to realize reduced costs and better productivity. UMC's Fab 12A in Taiwan is in volume production for 0.13 um customer products with yields (DD) equal to or greater than 200 mm equivalents.