Monolithic 3D Gate Array by MonolithIC 3D Inc

Product Description

Monolithic 3D IC technology can be applied to producing a monolithically stacked single crystal silicon wafer scale Continuous Array with custom, etched scribelines. Chiplets can be added with functions such as I/O and analog.
• Very high density Gate Array terrain
• Easy patterning with unidirectional layout
• Continuous Array allows flexible dicing for variable-sized chips
• 3D stacking allows flexible ratio between memory and logic
• 3D stacking allows ultra-high device density
• Single mask set for a complete range of Gate Array densities
• Flexible I/O and analog function configuration
• Re-use of older prequalified silicon I/O together with most advanced logic technology

Monolithic 3D Gate Array

Market Segment(s)

• Embedded
• Enterprise
• Mobile
• Mobile Computing