Join us for an insightful webinar series, "The CMSIS Solution," where we delve into the benefits, development flow, and layer concept of the work done in the Open-CMSIS-Pack working group, a joint industry effort led by Arm, NXP, and STMicroelectronics.

Each session helps deepen your understanding of the CMSIS Solution, covering key topics including:

• Benefits and advantages.
• Development and tool flow.
• Software discovery in areas like graphics, industrial connectivity, web, and AI/ML.
• Advanced use cases.

Guest speakers share how CMSIS-Packs help engineers quickly evaluate their software solutions.

Sessions begin with a 20-minute presentation or demo, followed by a 10-minute Q&A, giving you plenty of opportunities to engage with our experts and get your questions answered.

This series is tailored for embedded software developers and engineers looking to enhance their understanding and application of CMSIS in their projects. Many of the latest improvements will be demonstrated using Visual Studio Code.

Session 5: The Layer Concept

Dive into the layer concept of CMSIS, which provides a structured approach to software development. Learn how the different layers interact—including the core, driver, and middleware layers—and how they contribute to a modular and scalable software architecture. See how a sensor component uses the layer interface to port an application across multiple SoC targets.

Date: December 3, 2024
Time: 5 p.m. CET | 4 p.m. GMT | 8 a.m. PST

Don't miss this opportunity to deepen your knowledge and leverage the full potential of CMSIS in your projects. Watch the other episodes in the series!