AMBA

“The release of the first public CHI C2C specification marks a significant step towards an open chiplet ecosystem and contributes to improvements in interoperability. We are pleased to partner with Arm on early AMBA developments as it will impact future versions of our high-bandwidth, low-latency network-on-chip interconnect IP technology including Ncore and FlexNoC. We look forward to further cooperation across the emerging chiplet ecosystem.”

- Laurent Moll, COO of Arteris

“With its disaggregated solutions in the form of chiplets, droplets, dielets, tiles and such, the More-than-Moore era presents significant opportunities and technology challenges for both designers and implementers. The need for standardized interfaces is paramount to facilitate communication between chiplets from a multitude of providers and to avoid building a tower of Babel. Cadence has a history of close collaboration with Arm on AMBA standards, and we’re pleased to build upon our partnership and bring the new AMBA CHI C2C standard to market in our IP and chiplet solutions encompassing flows, reference designs and customer designs. This important new standard will be a key ecosystem enabler and should promote an open chiplet marketplace, which is still in its nascent stage.”

- David Glasco, VP of R&D for the Silicon Solutions Group at Cadence

“Fujitsu considers chiplets as essential technology for future processor architectures. We’re already adopters of the open, foundational AMBA specifications, and the latest AMBA CHI C2C specification is a step-change in establishing how to transport data efficiently in low-latency off-chip use cases, such as chiplet-to-chiplet. We’re excited to see how this will enable the chiplet ecosystem.”

- Toshio Yoshida, Executive Director, Advanced Technology Development Unit, Fujitsu

“Intel® has long envisioned a “chiplet revolution,” which was the motivation for our introducing the UCIe protocol to the industry in 2022. We are pleased to see the industry’s growth and adoption of UCIe™, advanced packaging technologies, and standards-based protocol mapping. Along with UCIe, the standardization and release of the AMBA CHI C2C specification is a critical building block for the industry’s drive toward chiplet based architectures and we are excited to continue our collaboration with Arm.”

- Bob Brennan, IFS, VP, Customer Solutions Engineering, Intel

“The AMBA CHI C2C specification will enable efficient chip-to-chip interconnectivity, allowing the creation of powerful AI systems that support coherency and confidential compute for a wide variety of use cases, from chiplets to off-package connectivity. Our significant work over the past four years to advance this new standard, in collaboration with Arm and other ecosystem partners, will help propel the industry forward and drive breakthroughs in AI and accelerated computing.”

- Ashish Karandikar, Vice President of Hardware Engineering at NVIDIA

“Chiplets provide a key architectural solution for the acceleration of computing performance needed by AI and other advanced workloads. As longstanding members of the AMBA ecosystem, we are excited to support the AMBA CHI C2C specification as an important enabling technology for next-generation chiplet designs.”

- Neeraj Paliwal, General Manager of Silicon IP, Rambus

“Chiplets will definitely be an effectively solution in the semiconductor industry for next decade to address dramatically cost of high performance SoC with advanced process node. Together, UCIe PHY will be used as the physical layer standard for chiplets interconnect and AMBA CHI C2C will be used as an open standard for the protocol layer for chiplets interconnect to extend on-chip CHI to multi-chiplet interconnect. AMBA CHI C2C not only ensure Arm architecture features like security, virtualization, etc. extend to multi-chiplet boundary and also lower chiplet-to-chiplet latency without additional protocol transition. AMBA CHI C2C as a fundamental protocol to enable compute chiplets, IO chiplets and accelerator chiplets interoperable in extensive widely Arm architecture ecosystem.”

- Owen Shi, Vice President of Sanechips

“Siemens EDA is pleased to support the development of AMBA, taking AMBA CHI C2C protocol to the growing chiplet ecosystem, which is an area of Siemens’ focus with our Avery Verification IP and Veloce hardware-assisted verification solutions.”

- Abhi Kolpekwar, VP and General Manager of Digital Verification Technology at Siemens EDA

“Chiplet-based architecture for compute could be a game-changer for Europe in the era of ubiquitous AI. In this context, one of the main challenges is to guarantee interoperability and composability at pace. The new AMBA CHI C2C specification will be key to achieving this. We’ve been proud to collaborate with Arm and the ecosystem in its development and release.”

- Philippe Notton, CEO & Founder of SiPearl

“With the shift to multi-die systems, designers require standard interfaces to maximize chiplet interoperability and minimize latency. Synopsys worked closely with Arm and its ecosystem to develop and optimize the CHI C2C specification. Supported by the complete Synopsys UCIe IP solution, this new chiplet standard will accelerate time-to-market and reduce die-to-die latency for a wide array of high-performance applications using Arm technology. This announcement builds on our longstanding technical engagement with Arm to optimize interoperability, performance, and bandwidth of systems that integrate Arm processors and Synopsys IP.”

- John Koeter, Senior Vice President of Marketing and Strategy for IP at Synopsys